Tuesday, June 23, 2009

US Patent 7550097 - Thermally conductive and electrically insulating nanocomposite


Thermal conduction and electrical conduction is found in metallic materials but for electronics cooling it can be undesirable to provide electrical conduction which can short out circuitry. This patent from Momentive Performance Materials teaches a nanocomposite thermal interface which provides the thermal conduction while avoiding electrical conduction. Claim 1 reads:

1. A thermal interface composition, comprising:

a blend of a polymer matrix, wherein the polymer matrix comprises a curable polymeric composition, at least one micron-sized filler, and nanoparticles that are electrically conductive relative to the micro-sized filler, wherein the thermal interface composition is thermally conducting and electrically non-conducting.