US Patent 7342179 - Metallic nanoparticle bonding layer

http://www.freepatentsonline.com/7342179.html

This patent from Seiko Epson (priority 1/14/2004) includes some basic claims to using fused nanoparticles as a bonding material. Claim 1 reads:

1. An electronic device comprising: two components; a receiving layer on at least one of the two components, the receiving layer including at least one of conductive particles and conductive fibers; and metallic nanoparticles on the receiving layer and bonding the two components together; wherein at least some of the nanoparticles are bonded together and closely contacted with the receiving layer by fusing.