Wednesday, February 28, 2007

US Patent 7183003 - Thermal interface using silver colloid and carbon nanotubes

Some R&D is underway by several different companies in the use of carbon nanotubes/polymer composites in heat sinks and thermal interface material. This patent from Hon Hai Precision prioposes a silver colloid base as the binding matrix for the nanotubes to improve the thermal conductivity and flexibility while reducing the thickness of the material. Claim 1 reads:

1. A thermal interface material comprising: a silver colloid base having a first surface and a second surface opposite to the first surface; and a plurality of carbon nanotubes uniformly disposed in the silver colloid base, the carbon nanotubes being substantially parallel to each other, the carbon nanotubes extending from the first surface to the second surface of the silver colloid base.